TIWARI, Rupali (777) et al. Investigation of thermophysical properties of Turkey oak particleboard for sustainable building envelopes. In Developments in the built environment [elektronický zdroj]. ISSN 2666-1659, 2023, vol. 16, art. no. 100228 [13 p.] [online]. VEGA 1/0714/21 ; APVV-19-0269 ; SK-CZ-RD-21-0100 ; PNRR CN00000022. CCC, WOS, SCOPUS. Dostupné na internete: <https://www.sciencedirect.com/science/article/pii/S2666165923001102>